The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Feb. 09, 2021
Applicant:

Nova Ltd., Rehovot, IL;

Inventors:

Vladimir Machavariani, Rishon-Lezion, IL;

Michael Shifrin, Ashqelon, IL;

Daniel Kandel, Ramat Gan, IL;

Victor Kucherov, Ashdod, IL;

Igor Ziselman, Modi'In-Maccabim-Re'Ut, IL;

Ronen Urenski, Bat Yam, IL;

Matthew Sendelbach, Fishkill, NY (US);

Assignee:

NOVA LTD, Rehovot, IL;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/26 (2006.01); G06T 7/00 (2017.01); G06T 7/60 (2017.01); H01J 37/22 (2006.01); G06T 15/20 (2011.01); G06T 17/05 (2011.01); G06T 7/246 (2017.01); G06T 19/00 (2011.01);
U.S. Cl.
CPC ...
H01J 37/26 (2013.01); G06T 7/0006 (2013.01); G06T 7/0008 (2013.01); G06T 7/0014 (2013.01); G06T 7/251 (2017.01); G06T 7/60 (2013.01); G06T 15/205 (2013.01); G06T 17/05 (2013.01); G06T 19/003 (2013.01); H01J 37/222 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/20076 (2013.01); H01J 2237/221 (2013.01); H01J 2237/24592 (2013.01);
Abstract

A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.


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