The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Apr. 11, 2018
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Satoru Yamaki, Tokyo, JP;

Makoto Fukushima, Tokyo, JP;

Keisuke Namiki, Tokyo, JP;

Osamu Nabeya, Tokyo, JP;

Shingo Togashi, Tokyo, JP;

Tomoko Owada, Tokyo, JP;

Yoshikazu Kato, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); B24B 7/04 (2006.01); B24B 37/10 (2012.01); B24B 37/30 (2012.01);
U.S. Cl.
CPC ...
H01L 21/68707 (2013.01); B24B 7/04 (2013.01); B24B 37/107 (2013.01); B24B 37/30 (2013.01);
Abstract

An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.


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