The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Dec. 09, 2015
Applicant:

Acm Research (Shanghai) Inc., Shanghai, CN;

Inventors:

Fuping Chen, Shanghai, CN;

Hui Wang, Shanghai, CN;

Xi Wang, Shanghai, CN;

Shena Jia, Shanghai, CN;

Danying Wang, Shanghai, CN;

Chaowei Jiang, Shanghai, CN;

Yingwei Dai, Shanghai, CN;

Jian Wang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/12 (2006.01); H01L 21/02 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); B08B 3/10 (2006.01); B01D 19/00 (2006.01); F04B 15/04 (2006.01); H01L 21/67 (2006.01); F04B 23/00 (2006.01); B08B 7/02 (2006.01); B08B 7/04 (2006.01); F04B 23/04 (2006.01);
U.S. Cl.
CPC ...
B01D 19/0036 (2013.01); B01D 19/00 (2013.01); B08B 3/041 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); B08B 3/12 (2013.01); B08B 7/028 (2013.01); B08B 7/04 (2013.01); F04B 15/04 (2013.01); F04B 23/00 (2013.01); H01L 21/02052 (2013.01); H01L 21/02057 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); B08B 2203/007 (2013.01); B08B 2203/027 (2013.01); F04B 23/04 (2013.01);
Abstract

The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned. The present invention also provides an apparatus including the high temperature chemical solution supply system and an ultra or mega sonic device for cleaning the substrate. The present invention also provides methods for cleaning the substrates.


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