The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Apr. 13, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Shing-Chao Chen, Zhubei, TW;
Chih-Wei Lin, Zhubei, TW;
Meng-Tse Chen, Changzhi Township, TW;
Hui-Min Huang, Taoyuan, TW;
Ming-Da Cheng, Zhubei, TW;
Kuo-Lung Pan, Hsinchu, TW;
Wei-Sen Chang, Jinsha Township, TW;
Tin-Hao Kuo, Hsinchu, TW;
Hao-Yi Tsai, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die and a protection layer encapsulating the semiconductor die. The chip package also includes a conductive structure in the protection layer and separated from the semiconductor die by the protection layer. The chip package further includes an interconnection structure over the conductive structure and the protection layer. The interconnection structure has a protruding portion between the conductive structure and the semiconductor die, and the protruding portion extends into the protection layer.