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For the Inventor, By the Inventor

Zhubei, Taiwan

Shing-Chao Chen

USPTO Granted Patents = 22 

Average Co-Inventor Count = 4.8

ph-index = 4

Forward Citations = 43(Granted Patents)


Location History:

  • Zhubei, TW (2016 - 2024)
  • Hsinchu County, TW (2019 - 2024)

Company Filing History:

goldMedal22 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2016-2025

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22 patents (USPTO):
1. 12444719 - Package and manufacturing method thereof (2025-10-14),
2. 12322640 - Semiconductor package and manufacturing method thereof (2025-06-03),
3. 12125797 - Package structure with fan-out feature (2024-10-22),
4. 12080653 - Formation method of chip package with fan-out structure (2024-09-03),
5. 12033992 - Package and manufacturing method thereof (2024-07-09),
6. 11776838 - Semiconductor package and manufacturing method thereof (2023-10-03),
7. 11404381 - Chip package with fan-out structure (2022-08-02),
8. 11177156 - Semiconductor package, manufacturing method of semiconductor device and semiconductor package (2021-11-16),
9. 11088124 - Package and manufacturing method thereof (2021-08-10),
10. 10964663 - Die bonder and methods of using the same (2021-03-30),
11. 10950572 - Die bonder and methods of using the same (2021-03-16),
12. 10867953 - Manufacturing method of integrated fan-out package (2020-12-15),
13. 10840111 - Chip package with fan-out structure (2020-11-17),
14. 10797038 - Semiconductor package and rework process for the same (2020-10-06),
15. 10515900 - Chip package with fan-out structure (2019-12-24),

Title: Innovations of Shing-Chao Chen in Semiconductor Technology

Introduction

Shing-Chao Chen, a prominent inventor located in Zhubei, Taiwan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 20 patents, he continues to innovate in packaging structures that enhance the performance and reliability of semiconductor devices.

Latest Patents

Among his notable inventions, Shing-Chao Chen’s latest patents focus on advanced package structures with fan-out features. One of these patents describes a package structure that includes a semiconductor chip, a first dielectric layer, and a conductive layer featuring multiple protruding portions. The innovative design allows for improved conductivity and thermal management in semiconductor applications. Another recent patent outlines a method for forming chip packages with a fan-out structure, detailing the processes of disposing semiconductor dies and forming dielectric layers effectively. These advanced methods contribute to the efficiency and functionality of chip packaging.

Career Highlights

Shing-Chao Chen is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in semiconductor manufacturing. His work is characterized by a commitment to developing cutting-edge technologies that push the boundaries of traditional semiconductor packaging. The impact of his inventions reflects his expertise and dedication to enhancing electronic devices utilized in various industries.

Collaborations

Throughout his career, Shing-Chao Chen has collaborated with talented colleagues, including Chih-Wei Lin and Ching-Hua Hsieh. These partnerships have fostered an environment of innovation, allowing for the exchange of ideas and techniques that drive progress in semiconductor technologies.

Conclusion

Shing-Chao Chen exemplifies the spirit of innovation in the semiconductor industry. His extensive patent portfolio highlights his ability to address complex challenges in chip packaging, making significant strides in the functionality of electronic devices. As he continues to develop new technologies, his contributions will undoubtedly influence future advancements in the field.

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