The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Feb. 25, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
An-Jhih Su, Bade, TW;
Shing-Chao Chen, Zhubei, TW;
Ching-Hua Hsieh, Hsin-Chu, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Der-Chyang Yeh, Hsin-Chu, TW;
Ming-Da Cheng, Jhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An embodiment is a method including bonding a first package to a first set of conductive pads of a second package with a first set of solder joints, testing the first package for defects, heating the first set of solder joints by directing a laser beam at a surface of the first package based on testing the first package for defects, after the first set of solder joints are heated, removing the first package, and bonding a third package to the first set of conductive pads of the second package.