The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Jan. 24, 2019
Kla-tencor Corporation, Milpitas, CA (US);
David Y. Wang, Santa Clara, CA (US);
Esen Salcin, Tempe, AZ (US);
Michael Friedmann, Mountain View, CA (US);
Derrick Shaughnessy, San Jose, CA (US);
Andrei V. Shchegrov, Campbell, CA (US);
Jonathan M. Madsen, Los Altos, CA (US);
Alexander Kuznetsov, Austin, TX (US);
KLA-Tencor Corporation, Milpitas, CA (US);
Abstract
Methods and systems for performing co-located measurements of semiconductor structures with two or more measurement subsystems are presented herein. To achieve a sufficiently small measurement box size, the metrology system monitors and corrects the alignment of the measurement spot of each metrology subsystem with a metrology target to achieve maximum co-location of the measurement spots of each metrology subsystem with the metrology target. In another aspect, measurements are performed simultaneously by two or more metrology subsystems at high throughput at the same wafer location. Furthermore, the metrology system effectively decouples simultaneously acquired measurement signals associated with each measurement subsystem. This maximizes signal information associated with simultaneous measurements of the same metrology by two or more metrology subsystems.