The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Apr. 01, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Marko Radosavljevic, Portland, OR (US);

Ravi Pillarisetty, Portland, OR (US);

Gilbert Dewey, Beaverton, OR (US);

Niloy Mukherjee, San Ramon, CA (US);

Jack Kavalieros, Portland, OR (US);

Willy Rachmady, Beaverton, OR (US);

Van Le, Portland, OR (US);

Benjamin Chu-Kung, Portland, OR (US);

Matthew Metz, Portland, OR (US);

Robert Chau, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 21/8258 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01); H01L 21/8238 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01); B82Y 10/00 (2011.01); H01L 29/66 (2006.01); H01L 29/775 (2006.01); H01L 29/78 (2006.01); H01L 29/205 (2006.01);
U.S. Cl.
CPC ...
H01L 21/845 (2013.01); B82Y 10/00 (2013.01); H01L 21/0228 (2013.01); H01L 21/02532 (2013.01); H01L 21/02546 (2013.01); H01L 21/30604 (2013.01); H01L 21/8258 (2013.01); H01L 21/823821 (2013.01); H01L 27/092 (2013.01); H01L 27/0922 (2013.01); H01L 27/0924 (2013.01); H01L 27/1211 (2013.01); H01L 29/0673 (2013.01); H01L 29/16 (2013.01); H01L 29/20 (2013.01); H01L 29/42392 (2013.01); H01L 29/66439 (2013.01); H01L 29/66469 (2013.01); H01L 29/775 (2013.01); H01L 29/78696 (2013.01); H01L 21/823807 (2013.01); H01L 29/205 (2013.01); H01L 29/785 (2013.01); H01L 29/7853 (2013.01);
Abstract

Architectures and techniques for co-integration of heterogeneous materials, such as group III-V semiconductor materials and group IV semiconductors (e.g., Ge) on a same substrate (e.g. silicon). In embodiments, multi-layer heterogeneous semiconductor material stacks having alternating nanowire and sacrificial layers are employed to release nanowires and permit formation of a coaxial gate structure that completely surrounds a channel region of the nanowire transistor. In embodiments, individual PMOS and NMOS channel semiconductor materials are co-integrated with a starting substrate having a blanket layers of alternating Ge/III-V layers. In embodiments, vertical integration of a plurality of stacked nanowires within an individual PMOS and individual NMOS device enable significant drive current for a given layout area.


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