The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Dec. 24, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Willy Rachmady, Beaverton, OR (US);

Matthew V. Metz, Portland, OR (US);

Gilbert Dewey, Hillsboro, OR (US);

Chandra S. Mohapatra, Beaverton, OR (US);

Nadia M. Rahhal-Orabi, Lake Oswego, OR (US);

Jack T. Kavalieros, Portland, OR (US);

Anand S. Murthy, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/205 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1083 (2013.01); H01L 29/0653 (2013.01); H01L 29/0847 (2013.01); H01L 29/205 (2013.01); H01L 29/66522 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

Embodiments of the present disclosure describe a semiconductor multi-gate transistor having a semi-conductor fin extending from a substrate and including a sub-fin region and an active region. The sub-fin region may include a dielectric material region under the gate to provide improved isolation. The dielectric material region may be formed during a replacement gate process by replacing a portion of a sub-fin region under the gate with the dielectric material region, followed by fabrication of a replacement gate structure. The sub-fin region may be comprised of group III-V semiconductor materials in various combinations and concentrations. The active region may be comprised of a different group III-V semiconductor material. The dielectric material region may be comprised of amorphous silicon. Other embodiments may be described and/or claimed.


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