The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Oct. 13, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Balaji Kannan, Clifton Park, NY (US);

Ayse M. Ozbek, Malta, NY (US);

Tao Chu, Mechanicville, NY (US);

Bala Haran, Latham, NY (US);

Vishal Chhabra, Clifton Park, NY (US);

Katsunori Onishi, Somers, NY (US);

Guowei Xu, Ballston Lake, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 27/02 (2006.01); H01L 21/311 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 21/027 (2006.01); H01L 21/8238 (2006.01); H01L 29/51 (2006.01); H01L 27/11 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0924 (2013.01); H01L 21/0274 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/823431 (2013.01); H01L 21/823437 (2013.01); H01L 21/823481 (2013.01); H01L 21/823828 (2013.01); H01L 21/823878 (2013.01); H01L 27/0207 (2013.01); H01L 29/0649 (2013.01); H01L 29/66545 (2013.01); H01L 27/1104 (2013.01); H01L 29/517 (2013.01);
Abstract

The present disclosure relates to semiconductor structures and, more particularly, to a cut inside a replacement metal gate trench to mitigate n-p proximity effects and methods of manufacture. The structure described herein includes: a first device; a second device, adjacent to the first device; a dielectric material, of the first device and the second device, including a cut within a trench between the first device and the second device; and a common gate electrode shared with the first device and the second device, the common gate electrode provided over the dielectric material and contacting underlying material within the cut.


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