The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Feb. 16, 2017
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Tsung-Yu Chen, Hsinchu, TW;
Wensen Hung, Hsinchu County, TW;
Hung-Chi Li, Taipei, TW;
Cheng-Chieh Hsieh, Tainan, TW;
Tung-Liang Shao, Hsinchu, TW;
Chih-Hang Tung, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor structure includes a die including a surface, a lid disposed over the surface of the die, and a thermally conductive material disposed between the die and the lid, wherein the lid includes a protrusion protruded towards the surface of the die and the thermally conductive material surrounds the protrusion. Also, a method of manufacturing a semiconductor structure includes providing a die including a surface, providing a lid, removing a portion of the lid to form a protrusion, disposing a thermally conductive material between the surface of the die and the lid, wherein the protrusion of the lid is surrounded by the thermally conductive material. Further, an apparatus for manufacturing a semiconductor structure and a method of manufacturing a semiconductor structure by the apparatus are disclosed.