The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Feb. 23, 2017
Applicant:

Tokyo Electron Limited, Minato-ku, Tokyo, JP;

Inventors:

Shyam Sridhar, Albany, NY (US);

Li Wang, Portland, OR (US);

Andrew Nolan, Albany, NY (US);

Hiroto Ohtake, Hillsboro, OR (US);

Sergey Voronin, Delmar, NY (US);

Alok Ranjan, Tomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/461 (2006.01); H01L 21/027 (2006.01); H01L 21/3065 (2006.01); H01L 21/306 (2006.01); H01L 21/033 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); H01L 21/0234 (2013.01); H01L 21/0272 (2013.01); H01L 21/02126 (2013.01); H01L 21/02315 (2013.01); H01L 21/0331 (2013.01); H01L 21/3065 (2013.01); H01L 21/30604 (2013.01);
Abstract

Methods and systems for selective silicon anti-reflective coating (SiARC) removal are described. An embodiment of a method includes providing a substrate in a process chamber, the substrate comprising: a resist layer, a SiARC layer, a pattern transfer layer, and an underlying layer. Such a method may also include performing a pattern transfer process configured to remove the resist layer and create a structure on the substrate, the structure comprising portions of the SiARC layer and the pattern transfer layer. The method may additionally include performing a modification process on the SiARC layer of the structure, the modification converting the SiARC layer into a porous SiARC layer. Further, the method may include performing a removal process of the porous SiARC layer of the structure, wherein the modification and removal processes of the SiARC layer are configured to meet target integration objectives.


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