Sichuan, China

Zhi Peng Feng

USPTO Granted Patents = 3 

Average Co-Inventor Count = 7.3

ph-index = 1


Location History:

  • SiChuan, CN (2022)
  • Chengdu, CN (2024)

Company Filing History:


Years Active: 2022-2024

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3 patents (USPTO):Explore Patents

Title: **Innovations by Zhi Peng Feng: Pioneering Advances in Semiconductor Devices**

Introduction

Zhi Peng Feng, based in Chengdu, China, is an accomplished inventor known for his significant contributions to the field of semiconductor technology. With a unique approach to device design, he has been able to develop innovative solutions that enhance the performance and reliability of electronic components.

Latest Patents

Zhi Peng Feng holds a patent for a "Multi-layer polysilicon stack for semiconductor devices." This patent outlines a method for forming a capacitor, which includes several key steps: the formation of a doped polysilicon layer over a semiconductor substrate, the application of a dielectric layer atop the doped polysilicon layer, and the addition of an undoped polysilicon layer on the dielectric layer. This innovative method demonstrates significant potential for improving the performance of semiconductor devices.

Career Highlights

Currently, Zhi Peng Feng is employed by Texas Instruments Corporation, a leader in semiconductor design and manufacturing. His work at Texas Instruments has positioned him at the forefront of technological advancements within the industry. Feng's expertise in polysilicon technology has allowed him to contribute to various projects that aim to advance semiconductor applications.

Collaborations

Throughout his career, Zhi Peng Feng has collaborated with several talented professionals, including Furen Lin and Yunlong Liu. These collaborations have fostered a dynamic exchange of ideas, leading to creative solutions in their respective projects. Together, they continue to push the boundaries of innovation in the semiconductor industry.

Conclusion

Zhi Peng Feng's innovative approach to semiconductor technology, highlighted by his patent on multi-layer polysilicon stacks, showcases his dedication to advancing the field. His current role at Texas Instruments Corporation and collaborations with fellow inventors reflect his commitment to innovation and the development of cutting-edge solutions in the semiconductor landscape.

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