Zheng Zheng

Title: Innovations by Inventor Zheng Zheng

Introduction

Zheng Zheng is a notable inventor based in Singapore, SG. He has made significant contributions to the field of integrated circuit packaging, holding a total of 6 patents. His work focuses on innovative designs and manufacturing methods that enhance the efficiency and functionality of integrated circuits.

Latest Patents

Zheng Zheng's latest patents include an "Integrated circuit packaging system with tiebar-less design and method of manufacture thereof." This patent describes a method for manufacturing an integrated circuit packaging system that involves several steps, including the attachment of an integrated circuit die to a die attach pad and the formation of an encapsulation over the die. Another significant patent is the "Integrated circuit package system with integral inner lead and paddle." This invention outlines a process for fabricating a lead frame that includes inner leads and a molded package body, which improves the overall design and performance of integrated circuit packages.

Career Highlights

Throughout his career, Zheng Zheng has worked with prominent companies in the industry, including St Assembly Test Services Inc. and Stats Chippac Pte. Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in integrated circuit technology.

Collaborations

Zheng Zheng has collaborated with talented individuals such as Byung Joon Han and Hien Boon Tan. These partnerships have fostered a creative environment that has led to innovative solutions in the field of integrated circuits.

Conclusion

Zheng Zheng's contributions to integrated circuit packaging have established him as a key figure in the industry. His innovative patents and collaborative efforts continue to influence advancements in technology.