The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Jun. 16, 2003
Applicants:
Jefferey D. Punzalan, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Zheng Zheng, Singapore, SG;
Jae Hak Yee, Singapore, SG;
Byung Joon Han, Singapore, SG;
Inventors:
Jefferey D. Punzalan, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Zheng Zheng, Singapore, SG;
Jae Hak Yee, Singapore, SG;
Byung Joon Han, Singapore, SG;
Assignee:
ST Assembly Test Services Pte Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/495 ;
U.S. Cl.
CPC ...
Abstract
A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.