Zheng-Yi Lim

This inventor holds 13 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2020.

USPTO Granted Patents = 13 (Patent Applications = 1)

% Patents Active = 69.2

Average Co-Inventor Count = 4.7

ph-index = 4

Forward Citations = 69(Granted Patents)

Company Filing History:

13 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2012-2020

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10840212 - Bonding package components through plating (2020-11-17),

2. 10483230 - Bonding package components through plating (2019-11-19),

3. 9953891 - Method of forming post-passivation interconnect structure (2018-04-24),

4. 9691738 - Bonding package components through plating (2017-06-27),

5. 9275965 - Copper pillar bump with cobalt-containing sidewall protection layer (2016-03-01),

6. 9117772 - Bonding package components through plating (2015-08-25),

7. 9099396 - Post-passivation interconnect structure and method of forming the same (2015-08-04),

8. 9048135 - Copper pillar bump with cobalt-containing sidewall protection (2015-06-02),

9. 8865586 - UBM formation for integrated circuits (2014-10-21),

10. 8501615 - Metal bump formation (2013-08-06),

11. 8258055 - Method of forming semiconductor die (2012-09-04),

12. 8242011 - Method of forming metal pillar (2012-08-14),

13. 8227334 - Doping minor elements into metal bumps (2012-07-24),

Title: Innovations of Zheng-Yi Lim

Introduction

Zheng-Yi Lim is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on innovative methods that enhance the efficiency and reliability of electronic components.

Latest Patents

One of Zheng-Yi Lim's latest patents involves a method for bonding package components through plating. This method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on both connectors. The metal layer effectively bonds the first electrical connector to the second electrical connector, ensuring a secure connection.

Career Highlights

Zheng-Yi Lim has established himself as a key figure in the semiconductor industry. He works at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate and develop new technologies. His expertise in electrical connectors and bonding methods has positioned him as a valuable asset to his team and the industry at large.

Collaborations

Zheng-Yi Lim collaborates with talented individuals such as Chung-Shi Liu and Yi-Wen Wu. These partnerships enhance the creative process and lead to groundbreaking advancements in semiconductor technology.

Conclusion

Zheng-Yi Lim's contributions to the field of semiconductor technology through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and pave the way for future advancements.