The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Jul. 23, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yi-Wen Wu, Xizhi, TW;
Zheng-Yi Lim, Hsinchu, TW;
Ming-Che Ho, Tainan, TW;
Chung-Shi Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method includes coating a passivation layer overlying a semiconductor substrate and forming an interconnect layer overlying the passivation layer. The interconnect layer includes a line region and a landing pad region. The method further includes forming a metallic layer including tin on a surface of the interconnect layer using an immersion process, forming a protective layer on the metallic layer, and exposing a portion of the metallic layer on the landing pad region of the interconnect layer through the protective layer.