The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Jun. 15, 2011
Ming-da Cheng, Jhubei, TW;
Chih-wei Lin, Xinfeng Township, TW;
Hsiu-jen Lin, Zhubei, TW;
Tzong-hann Yang, Taipei, TW;
Wen-hsiung LU, Jhonghe, TW;
Zheng-yi Lim, Hsin-Chu, TW;
Yi-wen Wu, Xizhi, TW;
Chung-shi Liu, Hsin-Chu, TW;
Ming-Da Cheng, Jhubei, TW;
Chih-Wei Lin, Xinfeng Township, TW;
Hsiu-Jen Lin, Zhubei, TW;
Tzong-Hann Yang, Taipei, TW;
Wen-Hsiung Lu, Jhonghe, TW;
Zheng-Yi Lim, Hsin-Chu, TW;
Yi-Wen Wu, Xizhi, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.