Shenzhen, China

Zhaozheng Hou

This inventor holds 20 USPTO granted patents and 8 published patent applications and 21 EPO patents, primarily in Power Semiconductor Technology. Top assignees: Huawei Technologies Co., Limited, Future Wei Technologies, Inc., Huawei Digital Power Technologies Co., Ltd.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhaozheng Hou. Retrieved from https://idiyas.com/inventor/zhaozheng-hou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 80.0

 

Average Co-Inventor Count = 2.1

ph-index = 3

Forward Citations = 110(Granted Patents)


Location History:

  • Shenzhen, CN (2012 - 2022)
  • Dongguan, CN (2023 - 2024)

Company Filing History:


Years Active: 2012-2026

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Areas of Expertise:
Injection Mold
Semiconductor Device
Chip Package Assembly
Power Supply Control
Gallium Nitride
Wireless Transmission
Printed Circuit Board
PWM Gate Drive
Soft Switching
Analog-to-Digital Converter
Tracking Power Supply
Power Amplifier
20 patents (USPTO):Explore Patents

Title: Zhaozheng Hou: A Trailblazer in Printed Circuit Board Innovations

Introduction

Zhaozheng Hou is a prominent inventor based in Shenzhen, China, known for his remarkable contributions to the field of electronics. With a total of 17 patents, he has significantly advanced technologies related to printed circuit boards and power semiconductor devices. His innovative approaches aim to enhance heat dissipation and overall functionality of electronic components.

Latest Patents

Zhaozheng Hou's latest patents showcase his expertise in printed circuit board technologies. One notable invention is a printed circuit board designed with good heat dissipation performance. This invention integrates a substrate as the board body, alongside an embedded heating component and a uniquely structured cooling liquid channel. The cooling channel efficiently exchanges heat with the heating component, resulting in improved heat dissipation efficiency and, consequently, a prolonged lifespan for the circuit board.

Another major invention is related to a power semiconductor device and its packaging structure. This innovative design features a semiconductor substrate doped with impurities to enhance its performance, an epitaxial layer, and a precise arrangement of doped regions and metal layers. These elements work in unison to improve the functionality of electronic devices, showcasing Hou's commitment to advancing semiconductor technologies.

Career Highlights

Throughout his career, Zhaozheng Hou has been affiliated with leading technology companies, including Huawei Technologies Co., Limited and Future Wei Technologies, Inc. His work at these companies has paved the way for groundbreaking advancements in electronic design and semiconductor technology, solidifying his reputation as a key player in the field.

Collaborations

In his professional journey, Hou has collaborated with notable coworkers such as Xujun Liu and Zhihua Liu. Together, they have contributed to various projects that focus on elevating the performance and efficiency of electronic devices through innovative designs and technologies.

Conclusion

Zhaozheng Hou stands as an influential figure in the realm of electronic innovations. His 17 patents epitomize his dedication to enhancing printed circuit board technologies and semiconductor devices. With continued advancements and collaborations, Hou is set to inspire future generations of inventors and engineers in the ever-evolving field of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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