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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11133128 B1

PDFFull Text
Date of Patent:
Sep. 28, 2021

Filed:

Jun. 28, 2018

System in package module assembly, system in package module, and electronic device

Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Yuping Gong, Shanghai, CN;

Zhaozheng Hou, Shenzhen, CN;

Junhe Wang, Shanghai, CN;

Assignee:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Attorney:

Leydig, Voit & Mayer, Ltd.

Primary Examiner:

Tszfung J Chan

Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01L 23/50 (2006.01); H01F 27/02 (2006.01); H01F 17/04 (2006.01); H01L 25/00 (2006.01); H01F 3/14 (2006.01); H01F 27/30 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01F 27/24 (2013.01); H01F 3/14 (2013.01); H01F 17/04 (2013.01); H01F 27/027 (2013.01); H01F 27/306 (2013.01); H01L 23/492 (2013.01); H01L 23/50 (2013.01); H01L 25/00 (2013.01); H01F 2017/048 (2013.01); H01L 23/49822 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01);
Abstract

A system in package module assembly is provided, and includes: a substrate, and a chip, an inductor, and an electrical element that are electrically connected to the substrate. The substrate includes a first surface, a second surface opposite to the first surface, and an accommodation groove. The accommodation groove passes through the second surface and the first surface. The inductor includes a magnetic core and an inductive coil. The magnetic core includes a base and a protrusion disposed on an outer surface of the base. The outer surface on which the protrusion is disposed and that is of the base abuts on the second surface. The protrusion is accommodated in the accommodation groove. The inductive coil is disposed in the protrusion. A system in package module and an electronic device are further provided.

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