The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Nov. 30, 2020
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Qijing He, Dongguan, CN;

Xiaojing Liao, Shanghai, CN;

Zhaozheng Hou, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H04B 1/04 (2006.01); H04B 5/00 (2006.01); H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/56 (2013.01); H01L 23/552 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 25/16 (2013.01); H04B 1/04 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82106 (2013.01);
Abstract

A wireless transmission module, chips, a passive component, and a coil are integrated into an integral structure, so that an integration level of the wireless transmission module is improved. In addition, the integral structure can effectively implement independence of the module, and the independent module can be flexibly arranged inside structural design of an electronic device, and does not need to be disposed on a mainboard of the electronic device. Only an input terminal of the wireless transmission module needs to be retained on the mainboard of the electronic device. In addition, the integral structure can further effectively increase a capability of a product for working continuously and normally in an extremely harsh scenario, and improve product reliability. In addition, in the structure of the wireless transmission module, the chips and the coil are integrated, and signal transmission paths between the chips and the coil are relatively short.


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