Yutaka Higashiguchi

Title: Yutaka Higashiguchi: Innovator in Electronic Packaging Technology

Introduction

Yutaka Higashiguchi is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of electronic packaging technology, holding a total of 12 patents. His innovative approaches have paved the way for advancements in assembly modules and electronic apparatuses.

Latest Patents

Higashiguchi's latest patents include a method of making assembly modules and board modules, as well as an electronic apparatus. In this method, a second member is superposed on a first member, with recognition marks described on both surfaces. The first recognition mark is fragmented along the edge of the second member, while the second recognition mark cooperates with the first for establishing a predetermined geometric pattern. This allows for reliable positioning of the second member on the first member. Another notable patent is for a ball grid array package that features electrodes on the peripheral side surfaces. This package includes a semiconductor chip that is electrically connected to various pads, ensuring efficient functionality.

Career Highlights

Throughout his career, Yutaka Higashiguchi has worked with notable companies such as Fujitsu Corporation and The Furukawa Electric Co., Ltd. His experience in these organizations has contributed to his expertise in electronic packaging and assembly technologies.

Collaborations

Higashiguchi has collaborated with esteemed colleagues, including Mitsuo Inagaki and Yasuhiro Teshima. These partnerships have further enhanced his innovative capabilities and contributions to the field.

Conclusion

Yutaka Higashiguchi's work in electronic packaging technology exemplifies the impact of innovation in modern electronics. His patents and collaborations reflect a commitment to advancing technology in this critical area.