Fujitsu Corporation

The Furukawa Electric Co., Ltd.

Yutaka Higashiguchi

Mitsuo Inagaki

Toshiaki Amano

Yasuhiro Teshima

Toshio Kumai

Makoto Totani

Yasushi Kobayashi

Yoshikazu Kamei

Hajime Mochizuki

Yasuhiro Ichihara

Ryoichi Ochiai

Mamoru Niishiro

Hiroshi Iimura

Shuzo Igarashi

Noriyuki Kohma

Takeyasu Maeda

Yukio Sekiya

Masaharu Hida

Kenichi Fuse

Hitoshi Yokemura

Hiroyuki Otaguro

Hirokazu Shiroishi

Masao Hosogai

Kinuko Mishiro

Masahiko Yamashita

Hidehiro Mishiro

Hideaki Tamura

Hirotaka Kashiwabara

Kouroh Mekata

Hidenori Tanizawa

Kohichi Kamei

Seishi Chiba

A second member is superposed on a first member. A first recognition mark is described on the surface of the first member. A second recognition mark is described on the surface of the second members. The first recognition mark is fragmented along the edge of the second member when the second member is superposed on the first member. The second recognition mark ends at the edge of the second member. The second recognition mark cooperates with the first recognition mark for establishment of a predetermined geometric pattern. The relative positions of the first and second recognition marks can be adjusted based on an irregular or unshaped geometric pattern. The second member can thus reliably be superposed on the surface of the first member at the correct position.

Method of making assembly module and board module and electronic apparatus

A ball grid array package includes a package board having a bottom surface, a top surface, and peripheral side surfaces, the bottom surface having solder ball pads provided thereon, the top surface having wire bonding pads provided thereon. A semiconductor chip is contained on the package board and electrically connected to the wire bonding pads. Solder balls are arrayed in a grid formation on the bottom surface of the package board and respectively soldered to the solder ball pads of the package board. Electrodes are provided on the peripheral side surfaces of the package board, each electrode having a first portion provided on one of the peripheral side surfaces, a second portion provided on the top surface and a third portion provided on the bottom surface. Wiring patterns are provided between the bottom surface and the top surface of the package board, electrically connecting the wire bonding pads with the second portions of the electrodes, and electrically connecting the solder ball pads with the third portions of the electrodes. The semiconductor chip is electrically connected to the solder ball pads through the electrodes and the wiring patterns.

Ball grid array package having electrodes on peripheral side surfaces of

A wiring board structure includes a board made of a material which can be etched by a given solution, an electrically conductive portion, which is thermally conductive, having a portion which extends from the board and which can be etched by the given solution, and an insulating layer having a portion which is in contact with the board and only the side surface of the electrically conductive portion and which prevents the board from being etched when the electrically conductive layer is etched.

Wiring board with an insulating layer to prevent gap formation during

A wiring board to be provided between a packaged electronic component having an integrated circuit and a mother board on which the packaged electronic component should be mounted, includes a base made of an insulating material, a first circuit pattern which is provided on a first surface of the base and has terminals connectable to terminals of the packaged electronic component for external connections, and a second circuit pattern which is provided on a second surface of the base opposite to the first surface thereof and has terminals connectable to terminals provided on the mother board.

Wiring board and semiconductor device

A semiconductor device includes a wiring board, an electronic component supported by the wiring board, a heat conduction layer provided in the wiring board so as to be in contact with the electronic component, and terminals provided on the wiring board and thermally connected to the heat conduction layer through thermal vias provided in the wiring board. Heat generated by the electronic component conducts to the terminals through the heat conduction layer and then conducts to a circuit board on which the semiconductor device is placed.

Semiconductor device having terminals for heat radiation

A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

Semiconductor device having a bump which is inspected from outside and a

A wiring substrate has a semiconductor device mounted thereonto, the semiconductor device having ball-shaped externally connecting parts. The wiring substrate includes through holes at positions corresponding to the ball-shaped externally connecting parts and electric conductors provided inside and around the through holes. Land portions of the electric conductors, at which the electric conductors are engaged with the externally connecting parts, includes sectional tapering portions, respectively. Further, the through holes have sectional tapering portions at edge portions in proximity to the land portions, respectively. The ball-shaped externally connecting parts of the semiconductor device are engaged with the land portions provided around the through holes of the wiring substrate and having the sectional tapering portions, respectively.

Wiring substrate and semiconductor device

A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

Semiconductor device and semiconductor device mounting board

An antenna module capable of finely adjusting the resonant frequency and having an antenna element exclusively used for radio transmission and reception to provide a broad frequency band characteristic. This antenna module is composed of a dielectric substrate molded in a predetermined shape, a grounding conductor in the form of sheet provided on one surface of the dielectric substrate, and antenna element conductor in the form of sheet provided on the opposite surface to the above one surface and having end portion being almost V-shaped end folded, and an adjusting member inserted into the almost V-shaped folded end portion.

Antenna module for a portable radio equipment with a grounding conductor

An antenna module suitable for a reduction in size and weight of equipment and improved in manufacturability. The antenna module includes a ground element formed from a planar conductor, an antenna element formed from a planar conductor and arranged in parallel to the ground element, and a loop element formed from a tubular conductor and arranged between the ground element and the antenna element in predetermined positional relationship with both elements so as to be connected with the antenna element. The loop element has a first hollow portion passing therethrough in a given direction. The antenna module further includes an element support formed from an insulator and arranged so as to fill a space between the ground element and the antenna element and substantially fully cover an outer surface of the loop element. The element support is formed with a second hollow portion passing therethrough in the same direction as that of the first hollow portion of the loop element.

Antenna module for incorporation in wireless terminal equipment such as

A manufacturing method for plural antenna modules which is suitable for mass production. Each antenna module includes a ground element, an antenna element, a loop element, and an element support. The manufacturing method for the antenna modules includes a first step of setting in a mold a first conductive base material including a plurality of the ground elements integrally connected together, a second conductive base material including a plurality of the antenna elements integrally connected together, and a third conductive base material including a plurality of the loop elements integrally connected together; a second step of filling a cavity defined in the mold with a curing fluid and then curing the curing fluid to thereby form an element support base material including a plurality of the element supports integrally connected together; and a third step of cutting the element support base material together with the first, second and third conductive base materials to thereby obtain a plurality of the antenna modules.

Manufacturing method for antenna module

A ground conducting layer and an antenna element conducting layer are set at a predetermined position in a cavity of a molding die, and molten resin is injected into the cavity, thereby molding a resin-formed member in which said ground conducting layer and said antenna element conducting layer are integrated. As a result of this, there can provided an antenna module comprising a resin member formed by molding to be a predetermined shape, a sheet-like ground conducting layer adhered to one surface of the resin member, a sheet-like antenna element conducting layer adhered to another surface opposing to the one surface of said resin member, and a feeder for feeding electricity to the antenna element conducting layer.

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Kawasaki, Japan

Yutaka Higashiguchi