The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 1998
Filed:
Feb. 21, 1996
Yutaka Higashiguchi, Kawasaki, JP;
Toshio Kumai, Kawasaki, JP;
Yasuhiro Teshima, Kawasaki, JP;
Mamoru Niishiro, Kawasaki, JP;
Yasushi Kobayashi, Kawasaki, JP;
Yukio Sekiya, Kawasaki, JP;
Shuzo Igarashi, Kawasaki, JP;
Yasuhiro Ichihara, Kawasaki, JP;
Fujitsu, Ltd., Kawasaki, JP;
Abstract
A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.