Company Filing History:
Years Active: 1998
Title: Innovations of Yukio Sekiya
Introduction
Yukio Sekiya is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents, his work focuses on enhancing the functionality and reliability of semiconductor devices.
Latest Patents
Yukio Sekiya's latest patents include innovative designs for semiconductor devices. One of his patents describes a semiconductor device having a bump that can be inspected from outside. This design allows for easy visual inspection of the soldered state of a BGA-type semiconductor device. The package features a bottom surface that faces the wiring board when mounted, with multiple soldering bumps of different sizes positioned for visibility. Another patent involves a semiconductor device that includes a package with opposing surfaces and slits, enabling a change in shape during the mounted state. This design reduces stress on soldered junctions, enhancing the device's durability.
Career Highlights
Yukio Sekiya is currently employed at Fujitsu Corporation, where he continues to innovate in semiconductor technology. His work has contributed to advancements in the industry, particularly in improving the reliability of electronic components.
Collaborations
Yukio has collaborated with notable coworkers such as Yutaka Higashiguchi and Toshio Kumai. Their combined expertise has fostered a productive environment for innovation at Fujitsu Corporation.
Conclusion
Yukio Sekiya's contributions to semiconductor technology through his patents reflect his commitment to innovation. His work not only enhances the functionality of semiconductor devices but also sets a standard for future developments in the field.