Fujitsu Corporation

Yukio Sekiya

Yasushi Kobayashi

Yutaka Higashiguchi

Yasuhiro Teshima

Toshio Kumai

Yasuhiro Ichihara

Mamoru Niishiro

Shuzo Igarashi

Mitsuo Inagaki

Ryoichi Ochiai

Hiroshi Iimura

Hideaki Tamura

Seishi Chiba

A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

Semiconductor device having a bump which is inspected from outside and a

A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

Semiconductor device and semiconductor device mounting board

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Kawasaki, Japan

Yukio Sekiya