The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2000
Filed:
Jan. 25, 1996
Applicant:
Inventors:
Yutaka Higashiguchi, Kawasaki, JP;
Mitsuo Inagaki, Kawasaki, JP;
Toshio Kumai, Kawasaki, JP;
Ryoichi Ochiai, Kawasaki, JP;
Makoto Totani, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257712 ; 257717 ;
Abstract
A semiconductor device includes a wiring board, an electronic component supported by the wiring board, a heat conduction layer provided in the wiring board so as to be in contact with the electronic component, and terminals provided on the wiring board and thermally connected to the heat conduction layer through thermal vias provided in the wiring board. Heat generated by the electronic component conducts to the terminals through the heat conduction layer and then conducts to a circuit board on which the semiconductor device is placed.