Yusaku Harada

Title: Yusaku Harada: Innovator in Ceramic Circuit Technology

Introduction

Yusaku Harada is a prominent inventor based in Omuta, Japan. He has made significant contributions to the field of ceramic circuit technology, holding a total of 6 patents. His work focuses on enhancing the performance and reliability of ceramic substrates used in electronic applications.

Latest Patents

Harada's latest patents include innovative designs for ceramic circuit boards. One notable patent is for a ceramic circuit substrate that boasts high bonding performance and excellent thermal cycling resistance properties. This invention features a ceramic substrate bonded to a copper plate using a braze material that contains silver (Ag) and copper (Cu), along with active metal components such as titanium (Ti) and zirconium (Zr). The braze material layer achieves a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv. Another significant patent involves a ceramic circuit substrate with a circuit pattern on a ceramic substrate, interposed with a braze material layer. This design ensures that an Ag-rich phase is formed continuously along the bonding interface, maintaining a bonding void ratio of 1.0% or less.

Career Highlights

Throughout his career, Yusaku Harada has worked with notable organizations, including Denka Company Limited and the University of Yamanashi. His experience in these institutions has allowed him to develop and refine his innovative ideas in ceramic technology.

Collaborations

Harada has collaborated with esteemed colleagues such as Kouji Nishimura and Akimasa Yuasa. Their combined expertise has contributed to the advancement of ceramic circuit technology.

Conclusion

Yusaku Harada's contributions to ceramic circuit technology are noteworthy, with a focus on improving bonding performance and thermal resistance. His innovative patents and collaborations highlight his commitment to advancing the field.