The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Apr. 24, 2018
Denka Company Limited, Tokyo, JP;
Yusaku Harada, Omuta, JP;
Akimasa Yuasa, Omuta, JP;
Takahiro Nakamura, Omuta, JP;
Shuhei Morita, Omuta, JP;
Kouji Nishimura, Omuta, JP;
DENKA COMPANY LIMITED, Tokyo, JP;
Abstract
A ceramic circuit substrate and power module with excellent heat cycle resistance characteristics, which is formed by bonding a ceramic substrate and a copper plate via a brazing material including Ag, Cu, and an active metal, wherein the bond void fraction is no greater than 1.0% and the diffusion distance of the Ag, which is a brazing material component, is 5-20 μm. Also, a method for manufacturing a ceramic circuit substrate characterized in that the heating time in a temperature range 400-700° C. in a process for raising the temperature to a bonding temperature is 5-30 minutes and bonding is performed by maintaining the bonding temperature at 720-800° C. for 5-30 minutes.