The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
May. 29, 2018
Applicant:
Denka Company Limited, Tokyo, JP;
Inventors:
Yuta Tsugawa, Omuta, JP;
Kouji Nishimura, Omuta, JP;
Yusaku Harada, Omuta, JP;
Ryota Aono, Omuta, JP;
Shoji Iwakiri, Omuta, JP;
Assignee:
DENKA COMPANY LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/30 (2006.01); C04B 37/02 (2006.01); H05K 1/03 (2006.01); C22C 5/08 (2006.01); B23K 101/42 (2006.01); B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); B23K 35/3006 (2013.01); C04B 37/023 (2013.01); C22C 5/08 (2013.01); B23K 1/0016 (2013.01); B23K 2101/42 (2018.08); C04B 2237/125 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); C04B 2237/706 (2013.01); Y10T 428/12875 (2015.01);
Abstract
A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, wherein a ceramic substrate and a copper plate are bonded by a braze material containing Ag and Cu, at least one active metal component selected from Ti and Zr, and at least one element selected from among In, Zn, Cd, and Sn, wherein a braze material layer, after bonding, has a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv.