Tainan, Taiwan

Yung-Yao Wang

This inventor holds 2 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2016-2017.


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2016-2017

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2 patents (USPTO):Explore Patents

Title: Yung-Yao Wang: Innovator in Semiconductor Technology

Introduction

Yung-Yao Wang is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer processing. With a total of 2 patents to his name, Wang's work has had a notable impact on the industry.

Latest Patents

Wang's latest patents focus on stress tuning for reducing wafer warpage. The first patent describes a method that includes forming a low-k dielectric layer over a substrate of a wafer, followed by the formation of multiple dielectric layers and a stress tuning dielectric layer. This innovative method involves etching processes that create a trench and a via opening, ultimately leading to the formation of a metal line and a via. The second patent outlines an integrated circuit structure that incorporates a substrate, low-k dielectric layers, and a metal line, with a stress tuning dielectric layer that features openings for enhanced functionality.

Career Highlights

Yung-Yao Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in wafer processing and integrated circuit design has positioned him as a valuable asset to the company.

Collaborations

Wang has collaborated with notable colleagues, including Ying-Han Chiou and Ling-Sung Wang. These partnerships have fostered innovation and advancement in their shared field of semiconductor technology.

Conclusion

Yung-Yao Wang's contributions to semiconductor technology through his patents and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as an influential inventor. His innovative methods for stress tuning in wafer processing continue to shape the future of the industry.

Profile summary based on public USPTO records.
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