Yokkaichi, Japan

Yukihiro Sakotsubo

USPTO Granted Patents = 9 

Average Co-Inventor Count = 1.5

ph-index = 3

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 2016-2024

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9 patents (USPTO):Explore Patents

Title: Innovations of Yukihiro Sakotsubo

Introduction

Yukihiro Sakotsubo is a prominent inventor based in Yokkaichi, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of nine patents. His work focuses on advanced memory devices that enhance data storage capabilities.

Latest Patents

Sakotsubo's latest patents include a three-dimensional memory device with plural channels per memory opening and methods of making the same. This innovative device features alternating stacks of insulating layers and electrically conductive layers. The memory opening fill structures consist of a memory film and multiple vertical semiconductor channels. Another notable patent is for a three-dimensional memory device that includes bump-containing bit lines and methods for manufacturing the same. This semiconductor die incorporates an alternating stack of insulating layers and electrically conductive layers on a substrate, with memory stack structures extending through the stack. The design includes drain regions at one end of the vertical semiconductor channels and bit lines that connect to these drain regions, featuring bump portions that enhance connectivity.

Career Highlights

Sakotsubo is currently employed at SanDisk Technologies Inc., where he continues to innovate in the semiconductor industry. His expertise in memory devices has positioned him as a key player in the development of cutting-edge technology.

Collaborations

He has collaborated with notable coworkers, including Yingda Dong and Yangyin Chen, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Yukihiro Sakotsubo's work in the field of memory devices exemplifies the spirit of innovation. His patents reflect a commitment to advancing technology and improving data storage solutions.

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