Location History:
- Toshima-Ku, JP (2011 - 2013)
- Tokyo, JP (2007 - 2022)
Company Filing History:
Years Active: 2007-2022
Title: Yuki Aritsuka: Innovator in Wiring Substrates and Semiconductor Devices
Introduction
Yuki Aritsuka is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the fields of wiring substrates and semiconductor devices. With a total of 14 patents to her name, Aritsuka has established herself as a key figure in technological innovation.
Latest Patents
Aritsuka's latest patents include a wiring substrate and a semiconductor device. The wiring substrate features a substrate with an insulating surface, a first conductive layer, a first insulating layer, and a second conductive layer. The design includes a first part with a specific thickness and a second part that is thinner and adjacent to the first part. The first insulating layer is strategically placed between the second conducting layer and the first part. Another notable patent is a method for manufacturing an information recording medium. This method allows for the durable recording of the same digital data on multiple media. It involves creating a minute graphic pattern on a resist layer formed on a quartz glass substrate, which is then used to prepare a master medium. The process includes shaping and transferring structures onto flexible recording media, resulting in a reproduction medium that mirrors the master medium.
Career Highlights
Aritsuka has worked with notable companies, including Dai Nippon Printing Co., Ltd. Her experience in these organizations has contributed to her expertise in the field of semiconductor technology and information recording.
Collaborations
Some of her coworkers include Tsuyoshi Chiba and Hiroshi Fujita. Their collaboration has likely played a role in advancing the innovative projects they have worked on together.
Conclusion
Yuki Aritsuka's contributions to the field of technology through her patents and collaborations highlight her role as a leading inventor. Her work continues to influence advancements in wiring substrates and semiconductor devices.