This inventor holds 1 USPTO granted patent. Top assignees: Nexperia B.v., Zhuhai Access Semiconductor Co., Ltd. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2025
Title: Yujun Zhao: Innovator in Package Substrate Manufacturing
Introduction
Yujun Zhao is a notable inventor based in Guangdong, China. He has made significant contributions to the field of package substrate manufacturing, showcasing his expertise through innovative methods and techniques. His work has led to the development of a unique patent that enhances the efficiency and effectiveness of manufacturing processes.
Latest Patents
Yujun Zhao holds a patent for a package substrate manufacturing method. This method includes several steps: providing a bearing plate, manufacturing a pattern, and depositing metal to form the first circuit layer. It also involves manufacturing a pattern on the first circuit layer, depositing and etching metal to create a metal cavity, laminating a dielectric layer on the metal cavity, and performing thinning to expose the metal cavity. The process continues with the removal of the bearing plate, etching the metal cavity to expose it, depositing metal on the cavity and dielectric layer, and performing pattern manufacturing and etching to form a second circuit layer. Finally, the method includes forming first and second solder mask layers on the respective circuit layers and cutting the cavity, circuit layers, and solder mask layers.
Career Highlights
Throughout his career, Yujun Zhao has worked with prominent companies in the semiconductor industry. He has been associated with Zhuhai Access Semiconductor Co., Ltd and Nexperia B.V., where he has applied his skills and knowledge to advance technology in his field. His experience in these companies has contributed to his reputation as an innovative inventor.
Collaborations
Yujun Zhao has collaborated with several professionals in his field, including Xianming Chen and Frank Burmeister. These collaborations have allowed him to share ideas and enhance his work in package substrate manufacturing.
Conclusion
Yujun Zhao is a distinguished inventor whose contributions to package substrate manufacturing have made a significant impact in the industry. His innovative methods and collaborations with other professionals highlight his dedication to advancing technology. His patent reflects his expertise and commitment to improving manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile