Company Filing History:
Years Active: 2022-2024
Title: **Yuichi Yanaka: Innovator in Semiconductor Bonding Technologies**
Introduction
Yuichi Yanaka is a distinguished inventor based in Tokyo, Japan, known for his significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, he has developed innovative methods for producing bonded objects, enhancing the efficiency in semiconductor manufacturing.
Latest Patents
Yanaka's latest patents include a "Method for Producing Bonded Object and Semiconductor Device" and "Copper Bonding Paste." The first patent outlines a comprehensive method involving the preparation of a laminate consisting of a first member, copper bonding paste, and a second member. This innovative process involves sintering the copper bonding paste under a controlled pressure of 0.1-1 MPa. The copper bonding paste is notable for its high content of metal particles, exceeding 50 mass %, with a significant focus on submicro copper particles, which make up 95 mass % or more of the metal particles.
The second patent, "Method for Producing Joined Body and Joining Material," describes a method that produces a joined body through a two-step process. This includes forming a laminated body with specific components, such as a metal pillar and an electrode pad, and using a joining material that consists of metal particles and an organic compound. The innovative aspect lies in the precise control of the joining material's properties during the sintering process, ensuring optimal adhesion and performance.
Career Highlights
Throughout his career, Yanaka has worked with esteemed companies such as Showa Denko Materials Co., Ltd. and Resonac Corporation. His experience in these organizations has enabled him to advance his research and apply his inventions in practical applications.
Collaborations
Yuichi Yanaka has collaborated with notable coworkers, including Hideo Nakako and Yoshinori Ejiri, contributing to a rich exchange of ideas and innovations that furthered advancements in semiconductor bonding technologies.
Conclusion
As an accomplished inventor, Yuichi Yanaka continues to push the boundaries of semiconductor technology through his innovative methods and materials. His patents not only reflect his expertise in the field but also promise to leave a lasting impact on the industry as it evolves.
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