Resonac Corporation

Showa Denko Materials Co., Ltd.

Yuichi Yanaka

Yoshinori Ejiri

Hideo Nakako

Yuki Kawana

Chie Sugama

Motohiro Negishi

Dai Ishikawa

An embodiment of the present invention provides a method for producing a bonded object. The method comprises a step for preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order and a step for sintering the copper bonding paste under a pressure of 0.1-1 MPa. The copper bonding paste contains metal particles and a dispersion medium, wherein the content of metal particles is at 50 mass % or more with respect to the total mass of the copper bonding paste, and the metal particles contain 95 mass % or more of submicro copper particles with respect to the total mass of the metal particles.

Method for producing bonded object and semiconductor device and copper bonding paste

Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I):()/&#xd7;100&#x2265;1.0&#x2003;&#x2003;(I)[in Formula (I), Mrepresents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and Mrepresents a non-volatile content in the joining material.]

Method for producing joined body, and joining material

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Tokyo, Japan

Yuichi Yanaka