Company Filing History:
Years Active: 2021-2025
Title: Innovations in Semiconductor Packaging: The Contributions of Yuanhao Yu
Introduction: Yuanhao Yu, an accomplished inventor based in Kaohsiung, Taiwan, has made significant strides in the field of semiconductor technology. With a total of 10 patents to his name, his work has primarily focused on innovative semiconductor device packages and their manufacturing methods.
Latest Patents: Among Yu's latest inventions is the advanced semiconductor device package featuring a substrate and an antenna module. This design incorporates a substrate with a first surface and a second surface, where the antenna module is strategically positioned on the first surface with a gap. The antenna module includes a support that has two distinct surfaces: one facing away from the substrate and the other facing it. The antenna layer features a first antenna pattern and a dielectric layer designed to enhance performance and efficiency. Additionally, another patent details a semiconductor device package that integrates a substrate, an antenna situated partially within it, and an active component that is electrically connected to the antenna. The design allows for the adjustable positioning of the antenna relative to the active component, showcasing Yu's innovative approach to device packaging.
Career Highlights: Yuanhao Yu's career is marked by his role at Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. His work reflects a commitment to enhancing device performance and reducing manufacturing complexities, thus contributing to advancements in electronic materials and technologies.
Collaborations: Throughout his career, Yu has collaborated with notable colleagues including Chun Chen Chen and Cheng-Lin Ho. These partnerships have fostered an environment of innovation and excellence within the field, leading to groundbreaking contributions in semiconductor technology.
Conclusion: Yuanhao Yu continues to be a prominent figure in the semiconductor industry, with his inventive spirit driving advancements in device packaging. His innovative patents not only highlight his engineering prowess but also play a crucial role in the evolution of semiconductor devices, impacting the technology landscape for years to come.