The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Jan. 31, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Cheng Yuan Chen, Kaohsiung, TW;
Jiming Li, Kaohsiung, TW;
Chun Chen Chen, Kaohsiung, TW;
Yuanhao Yu, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.