Advanced Semiconductor Engineering, Inc.

Yuanhao Yu

Chun Chen Chen

Cheng-Lin Ho

Cheng Yuan Chen

Jiming Li

Chih-Cheng Lee

Chien-Wen Tu

Mingjhih Tsai

Yu-Lin Shih

Hong Jie Chen

Chung Ju Yu

Chai-Chi Lin

Shang Chien Chen

Weifan Wu

Shih-Chun Li

Tingyen Chang

Jui-Hsien Wang

Fengchuan Tsai

Feng Chuan Tsai

Shih Yuan Ho

Wei Fan Wu

A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

Semiconductor packages and methods of manufacturing the same

A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A Sparameter of the connector is less than −20 dB.

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.

A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.

The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.

Semiconductor structure

A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than &#x2212;20 dB.

The present disclosure provides an electronic device. The electronic device includes a display module having a grounding element disposed under the display module and an antenna pattern. The grounding element is configured to function as a reference ground of the antenna pattern. A wearable device is also provided.

Electronic device and wearable device

A wearable device and method for operating the same are provided. The wearable device includes an antenna element, a first matching circuit, a second matching circuit, and a switch element. The first matching circuit has a first impedance value. The second matching circuit has a second impedance value different from the first impedance value. The switch element is configured to determine whether the antenna element is electrically connected with the first matching circuit or the second matching circuit.

Electronic device and method for operating the same

A semiconductor device package and a method for manufacturing the same are provided. The semiconductor device package includes a circuit layer and an antenna module. The circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface. The lateral surface extends between the first surface and the second surface. The circuit layer has an interconnection structure. The antenna module has an antenna pattern layer and is disposed on the first surface of the circuit layer. The lateral surface of the circuit layer is substantially coplanar with a lateral surface of the antenna module.

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Kaohsiung, Taiwan

Yuanhao Yu