Company Filing History:

10 out of 4,779

Mediatek Corporation

patents

2 out of 4

Nephos (hefei) Co. Ltd.

patents

2 out of 153

Mediatek Incorporation

patents

Years Active: 2008-2025

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12424531 - Semiconductor package structure (2025-09-23),

2. 12002742 - Semiconductor package structure (2024-06-04),

3. 11387176 - Semiconductor package structure (2022-07-12),

4. 10515939 - Wafer-level package having multiple dies arranged in side-by-side fashion and associated yield improvement method (2019-12-24),

5. 10261928 - Wafer-level package having one die with its clock source shared by multiple dies and associated clock generating method (2019-04-16),

6. 10037293 - Wafer-level package having asynchronous FIFO buffer used to deal with data transfer between different dies and associated method (2018-07-31),

7. 7852720 - Write strategy setting apparatus utilizing shared storage unit and method thereof (2010-12-14),

8. 7830192 - Delay circuit and related method thereof (2010-11-09),

9. 7821890 - Apparatus for writing a data to an optical storage media and servo control unit and laser diode driver unit thereof (2010-10-26),

10. 7804327 - Level shifters (2010-09-28),

11. 7782109 - Delay circuit and related method (2010-08-24),

12. 7778122 - Methods for tuning write strategy parameters utilizing data-to-clock edge deviations, and systems thereof (2010-08-17),

13. 7480221 - Method for generating control parameters for optimum write power and apparatus therefor (2009-01-20),

14. 7471599 - Write signal control circuit in an optical disk drive (2008-12-30),

Title: Innovations of Yuan-Chin Liu

Introduction

Yuan-Chin Liu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work has been instrumental in advancing semiconductor package structures, which are crucial for modern electronic devices.

Latest Patents

Among his latest patents, Yuan-Chin Liu has developed innovative semiconductor package structures. One of his notable inventions includes a semiconductor package structure that features a first substrate with a first wiring structure and a second substrate with a second wiring structure. These substrates are arranged side-by-side and are surrounded by a molding material. Additionally, the structure includes a redistribution layer that is electrically coupled to both wiring structures, along with a frame that surrounds the substrates. Another significant patent involves a semiconductor package structure that consists of a substrate, a first semiconductor die, and a second semiconductor die. This design incorporates a first substrate partition and a second substrate partition, each with their respective wiring structures, all surrounded by a molding material.

Career Highlights

Yuan-Chin Liu has worked with notable companies in the semiconductor industry, including MediaTek Corporation and Nephos (Hefei) Co. Ltd. His experience in these organizations has allowed him to refine his expertise and contribute to groundbreaking innovations in semiconductor packaging.

Collaborations

Throughout his career, Yuan-Chin Liu has collaborated with talented individuals such as Yi-Hung Chen and Tzu-Hung Lin. These partnerships have fostered a creative environment that has led to the development of advanced technologies in the semiconductor field.

Conclusion

Yuan-Chin Liu's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative designs continue to shape the future of electronic devices.

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