The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2018
Filed:
Feb. 04, 2016
Mediatek Inc., Hsin-Chu, TW;
Yi-Hung Chen, Yilan County, TW;
Yuan-Chin Liu, Hsinchu, TW;
Nephos (Hefei) Co. Ltd., Hefei, Anhui, CN;
Abstract
A wafer-level package has a first die and a second die. The first die has a first clock source arranged to generate a first clock, a first sub-system arranged to generate transmit data, and an output circuit arranged to output the transmit data according to the first clock. The second die has a second sub-system, a second clock source arranged to generate a second clock, and an input circuit having an asynchronous first-in first-out (FIFO) buffer. The input circuit buffers the transmit data transferred from the output circuit in the asynchronous FIFO buffer according to the first clock, and outputs the buffered transmit data in the asynchronous FIFO buffer to the second sub-system according to the second clock.