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For the Inventor, By the Inventor

Hsinchu, Taiwan

Yu-Ling Tsai

This inventor holds 13 USPTO granted patents and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Ling Tsai. Retrieved from https://idiyas.com/inventor/yu-ling-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13 

% Patents Active = 84.6

Average Co-Inventor Count = 4.7

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:

goldMedal13 out of 43,487 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2026

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13 patents (USPTO):Explore Patents
1. 12550775 - Semiconductor package with stiffener structure and method of manufacturing the same (2026-02-10),
2. 12550737 - Semiconductor package and method (2026-02-10),
3. 12354924 - Integrated circuit package and method (2025-07-08),
4. 12125757 - Semiconductor package with stiffener structure and method forming the same (2024-10-22),
5. 11984375 - Integrated circuit package and method (2024-05-14),
6. 11721602 - Semiconductor package with stiffener structure (2023-08-08),
7. 11658085 - Integrated circuit package and method (2023-05-23),
8. 11217497 - Integrated circuit package and method (2022-01-04),
9. 10665520 - Integrated circuit package and method (2020-05-26),
10. 9620414 - Protecting flip-chip package using pre-applied fillet (2017-04-11),
11. 9064881 - Protecting flip-chip package using pre-applied fillet (2015-06-23),
12. 8927333 - Die carrier for package on package assembly (2015-01-06),
13. 8373282 - Wafer level chip scale package with reduced stress on solder balls (2013-02-12),

Title: The Innovative Journey of Inventor Yu-Ling Tsai

Introduction: Yu-Ling Tsai, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions and patents.

Latest Patents: Yu-Ling Tsai holds several patents in the field of semiconductor technology, including a recent patent for a novel method of enhancing chip performance through advanced materials integration.

Career Highlights: With a career spanning over two decades, Tsai has worked with leading tech companies in Taiwan, honing his skills in research and development. His expertise in semiconductor design and fabrication has led to the creation of cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Yu-Ling Tsai has collaborated with top research institutions and universities in Taiwan, fostering a culture of innovation and knowledge sharing. His collaborative efforts have resulted in the development of groundbreaking technologies that have had a lasting impact on the semiconductor industry.

Conclusion: Yu-Ling Tsai's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the field of semiconductor technology. His contributions continue to inspire future generations of inventors and pave the way for a more technologically advanced future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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