The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Nov. 11, 2010
Tsung-fu Tsai, Changhua, TW;
Yian-liang Kuo, Toufen Township, TW;
Ming-song Sheu, Hsin-Chu, TW;
Yu-ling Tsai, Hsin-Chu, TW;
Chen-shien Chen, Zhubei, TW;
Han-ping Pu, Taichung, TW;
Tsung-Fu Tsai, Changhua, TW;
Yian-Liang Kuo, Toufen Township, TW;
Ming-Song Sheu, Hsin-Chu, TW;
Yu-Ling Tsai, Hsin-Chu, TW;
Chen-Shien Chen, Zhubei, TW;
Han-Ping Pu, Taichung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A die has a first surface, a second surface opposite the first surface, and sidewalls includes a first portion and a second portion, wherein the first portion is closer to the first surface than the second portion. A fillet contacts the first portion of sidewalls of the die and encircles the die. A work piece is bonded to the die through solder bumps, with the second surface facing the work piece. A first underfill is filled a gap between the die and the work piece, wherein the first underfill contacts the fillet, and wherein the first underfill and the fillet are formed of different materials.