The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Nov. 22, 2011
Tsung-shu Lin, New Taipei, TW;
Yu-ling Tsai, Hsinchu, TW;
Han-ping Pu, Taichung, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A package-on-package arrangement for maintaining die alignment during a reflow operation is provided. A first top die has a first arrangement of solder bumps. A bottom package has a first electrical arrangement to electrically connect to the first arrangement of solder bumps. A die carrier has a plurality of mounting regions defined on its bottom surface, wherein the first top die is adhered to the die carrier at a first of the plurality of mounting regions. One of a second top die and a dummy die having a second arrangement of solder bumps is also fixed to the die carrier at a second of the plurality of mounting regions of the die carrier. The first and second arrangements of solder bumps are symmetric to one another, therein balancing a surface tension during a reflow operation, and generally fixing an orientation of the die carrier with respect to the bottom package.