This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2016.
Company Filing History:
Years Active: 2016
Title: Yu-Fei Huang: Innovator in Multi-Via Interconnect Structures
Introduction
Yu-Fei Huang is a prominent inventor based in Pleasanton, CA (US). She has made significant contributions to the field of semiconductor technology. Her innovative work focuses on interconnect structures that enhance the performance of integrated circuits.
Latest Patents
Yu-Fei Huang holds a patent for a "Multi-via interconnect structure and method of manufacture." This patent describes an interconnect structure and a method for its formation. The process involves bonding two wafers (and/or dies) together. A multi-via interconnect structure is created that extends from the backside of a first substrate to interconnect structures in the metallization layers on both the first and second integrated circuits. The method includes thinning a first substrate of a first wafer and forming openings that are filled with conductive material, resulting in a robust multi-via interconnect structure. She has 1 patent to her name.
Career Highlights
Yu-Fei Huang is currently employed at Taiwan Semiconductor Manufacturing Company Limited. Her work at this leading semiconductor manufacturer has allowed her to push the boundaries of technology in the industry.
Collaborations
Throughout her career, Yu-Fei has collaborated with notable colleagues, including Edward Wan and Jacob Chen. These partnerships have contributed to her innovative projects and advancements in semiconductor technology.
Conclusion
Yu-Fei Huang is a trailblazer in the field of semiconductor technology, with her patent on multi-via interconnect structures showcasing her innovative spirit. Her contributions continue to influence the industry and pave the way for future advancements.