Yu-Chih Cheng

Title: Innovations of Yu-Chih Cheng in Semiconductor Packaging

Introduction

Yu-Chih Cheng is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on improving the reliability and efficiency of electronic packages.

Latest Patents

Yu-Chih Cheng's latest patents include a "Method for fabricating electronic package and carrier structure thereof" and "Electronic package and method for fabricating the same." The first patent describes a carrier structure that incorporates a strengthening layer composed of 5 to 30% by weight polysiloxane, 1 to 20% by weight silicon dioxide, and 60 to 85% by weight polyethylene terephthalate (PET) film. This innovative carrier structure enhances the reliability of semiconductor packaging processes. The second patent outlines a method for creating an electronic package that includes a filling material, such as an underfill, which is strategically placed between a carrier and multiple electronic components. This design features a spacing portion that acts as a stress buffer zone, effectively preventing damage to the electronic components during the grinding process of the encapsulation layer.

Career Highlights

Yu-Chih Cheng is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to develop cutting-edge technologies that advance the semiconductor industry. His patents reflect his commitment to innovation and excellence in electronic packaging.

Collaborations

Yu-Chih Cheng has collaborated with notable colleagues, including Tse-Yuan Lin and Chun-Ming Laio. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Yu-Chih Cheng's contributions to semiconductor packaging through his innovative patents demonstrate his expertise and dedication to the field. His work continues to influence advancements in electronic packaging technology.