logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11545385 B1

PDFFull Text
Date of Patent:
Jan. 03, 2023

Filed:

Mar. 23, 2021

Method for fabricating electronic package and carrier structure thereof

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Tse-Yuan Lin, Taichung, TW;

Chun-Ming Laio, Taichung, TW;

Yu-Chih Cheng, Taichung, TW;

Assignee:

SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;

Attorney:

Kelly & Kelley, LLP

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); B32B 17/10 (2006.01); B32B 7/14 (2006.01); B32B 27/36 (2006.01); B32B 27/20 (2006.01); C08L 67/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 7/14 (2013.01); B32B 17/10 (2013.01); B32B 27/20 (2013.01); B32B 27/36 (2013.01); C08L 67/02 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); B32B 2264/1021 (2020.08); B32B 2457/08 (2013.01); H01L 2221/68372 (2013.01);
Abstract

A carrier structure having a strengthening layer is provided. The strengthening layer comprises 5 to 30% by weight polysiloxane, 1 to 20% by weight silicon dioxide, and 60 to 85% by weight polyethylene terephthalate (PET) film. The carrier structure is used in a semiconductor packaging process for improving the process reliability.

Find Patent Forward Citations

Quick Actions:

Lin, Tse-Yuan. (2023). Method for fabricating electronic package and carrier structure thereof (U.S. Patent No. 11545385). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11545385

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…