The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Apr. 04, 2018
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Po-Hao Wang, Taichung, TW;
Chih-Jen Yang, Taichung, TW;
Yu-Chih Cheng, Taichung, TW;
Chee-Key Chung, Taichung, TW;
Chang-Fu Lin, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
An electronic package and a method for fabricating the same are provided. The method includes forming a filling material, such as an underfill, between a carrier and a plurality of electronic components and filling the filling material in a space between the electronic components to form a spacing portion. The spacing portion has a first segment and a second segment separated from each other to serve as a stress buffer zone. Therefore, when an encapsulation layer encapsulating the electronic components is subsequently ground, the present disclosure can effectively prevent the electronic components from being cracked due to stresses induced by the external grinding force.