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Gunpo-si, South Korea

Young-lyong Kim

USPTO Granted Patents = 12 (Patent Applications = 5)

Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 30(Granted Patents)

Location History:

Gyeonggi-do, KR (2010 - 2015)
Gunpo-si, KR (2014 - 2017)
Anyang-si, KR (2019 - 2021)

Company Filing History:

12 out of 131,744

Samsung Electronics Co., Ltd.

Years Active: 2010-2021

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11031347 - Semiconductor packages (2021-06-08),

2. 10804218 - Semiconductor package (2020-10-13),

3. 10658300 - Semiconductor package and semiconductor device including the same (2020-05-19),

4. 10438899 - Semiconductor packages (2019-10-08),

5. 9570423 - Semiconductor package and method of manufacturing the semiconductor package (2017-02-14),

6. 9281235 - Semiconductor packages and methods of forming the same (2016-03-08),

7. 9245816 - Semiconductor package and method of manufacturing the semiconductor package (2016-01-26),

8. 9159705 - Semiconductor chip connecting semiconductor package (2015-10-13),

9. 9024448 - Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package (2015-05-05),

10. 8884446 - Semiconductor packages (2014-11-11),

11. 7759795 - Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same (2010-07-20),

12. 7745907 - Semiconductor package including connector disposed in troughhole (2010-06-29),

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