The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Mar. 11, 2013
Applicant:
Samsung Electronics Co., Ltd, Suwon-Si, KR;
Inventors:
Young-lyong Kim, Gunpo-si, KR;
Seong-ho Shin, Hwaseong-si, KR;
Jae-gwon Jang, Hwaseong-si, KR;
Jong-ho Lee, Hwaseong-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/46 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/32145 (2013.01);
Abstract
A semiconductor package includes a master chip and a slave chip stacked on a substrate. The master chip and the slave chip are connected to one another by a bonding wire. The master chip and the slave chip are connected in series with an external circuit. The semiconductor package may have a low loading factor and excellent performance, and may be mass produced at low costs.